Packaging facility
Advanced photonic packaging, built in Canada
A $10M facility at Xanadu's Toronto headquarters for ultra-low loss photonic chip packaging, from R&D to pre-production, and open to external customers.
Why packaging
Packaging is where photonic chips lose light.
Every photon lost at a fiber or a bond makes fault tolerance harder to reach.
Xanadu's packaging line brings that work in-house: custom tooling and proprietary processes for ultra-low loss coupling, high-precision alignment and hybrid bonding, built for quantum-grade performance.
It secures domestic production of the components Xanadu's hardware roadmap depends on, and gives Canada's quantum ecosystem packaging capacity it previously had to source abroad.
$10M
Invested in the facility, supported in part by the federal Strategic Innovation Fund
0.085 dB
Average edge-coupling loss per facet, achieved on the line in 2026
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The only end-to-end, ultra-low loss photonic packaging facility of its kind in Canada
Inside the facility
From chip to packaged component
Ultra-low loss coupling
Custom edge-coupling processes connect optical fiber to photonic integrated circuits with an average loss of 0.085 dB per facet, one of the metrics that decides whether a photonic quantum computer can scale.
Precision alignment and hybrid bonding
In-house tooling aligns and bonds components with the precision quantum-grade performance needs, with workflows tailored for R&D, prototyping and pre-production volumes.
Open to partners
Beyond Xanadu's own roadmap, the facility is a national resource for advanced manufacturing, open to academic institutions, startups and industry teams developing next-generation photonic and quantum devices.
Work with us
Package your photonic devices with us
The facility is open to academic institutions, startups and industry teams developing photonic and quantum devices. Tell us about your project.